Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPOSITION FOR FORMING COATING FILM, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2017/010189
Kind Code:
A1
Abstract:
This composition for forming a coating film contains at least 5 parts by weight to 20 parts by weight of a first resin composition, 5 parts by weight to 20 parts by weight of a second resin composition, and 40 parts by weight to 65 parts by weight of an inorganic powder, and is characterized in that the first resin composition is a poly(meth)acrylate ester having a glass transition temperature Tg ≤ -20°C, and the second resin composition is a compound having one or more of each of the structures represented by general formulas (1) and (2). R1 in general formula (1) and R2 in general formula (2) are each independently a hydrogen atom or a methyl group. In general formula (2), X is an arbitrary substituent that is not a hydrogen atom.

Inventors:
SAKATA TOMONORI (JP)
Application Number:
PCT/JP2016/066627
Publication Date:
January 19, 2017
Filing Date:
June 03, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
C09D133/04; C03C8/16; C09D4/02; C09D7/12; H01B3/00; H01B3/02
Foreign References:
JP2001092118A2001-04-06
JP2000010276A2000-01-14
JP2000001632A2000-01-07
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF: