Title:
COMPOSITION FOR FORMING CONDUCTIVE FILM, AND CONDUCTIVE FILM MANUFACTURING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/156326
Kind Code:
A1
Abstract:
Provided is a composition for forming a conductive film, said composition containing: copper oxide particles (A) having an average particle size of 50-500 nm; at least one copper complex (B) having a molecular weight of 1000 or less selected from the group consisting of copper formate, and a salt of copper and acetone dicarboxylic acid or a derivative thereof; and a thermoplastic polymer (C). The composition has a copper complex (B) content of 5-30 mass% of the total mass of the copper oxide particles (A), and is capable of forming a conductive film that exhibits excellent adhesion to a substrate, and high conductivity (low resistance). Also provided is a conductive film manufacturing method using the composition.
Inventors:
HAYATA YUUICHI (JP)
Application Number:
PCT/JP2014/052875
Publication Date:
October 02, 2014
Filing Date:
February 07, 2014
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08K3/22; C09D201/00; C08K5/098; C08L101/00; C09D5/24; C09D7/12; C09D129/04; C09D139/06; C09D171/02; H01B1/20; H01B1/22; H01B13/00; H05K1/09; H05K3/12
Domestic Patent References:
| WO2010032841A1 | 2010-03-25 | |||
| WO2009116349A1 | 2009-09-24 |
Foreign References:
| JP2010242118A | 2010-10-28 | |||
| JP2012112022A | 2012-06-14 | |||
| JP2009256218A | 2009-11-05 | |||
| JP2009158441A | 2009-07-16 | |||
| JP2010176976A | 2010-08-12 | |||
| JP2005211732A | 2005-08-11 | |||
| JP2012151093A | 2012-08-09 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
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