Title:
COMPOSITION FOR FORMING CONDUCTOR LAYER, CONDUCTOR SUBSTRATE, AND METHOD FOR PRODUCING CONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2010/119787
Kind Code:
A1
Abstract:
Disclosed is a composition for forming a conductor layer, which is capable of forming a conductor layer that has excellent electrical conductivity. When a conductor layer is formed using the composition, the number of steps is reduced and no high-temperature treatment is required, thereby reducing the production cost of the conductor layer. Also disclosed are a conductor substrate using the composition for forming a conductor layer, and a method for producing the conductor substrate.
The composition for forming a conductor layer contains a metal complex represented by formula (1).
Inventors:
SHIMIZU, Katsuya (1-105, Kanda Jinbocho Chiyoda-k, Tokyo 01, 〒1018101, JP)
Application Number:
JP2010/056165
Publication Date:
October 21, 2010
Filing Date:
April 05, 2010
Export Citation:
Assignee:
ASAHI KASEI E-MATERIALS CORPORATION (1-105, Kanda Jinbocho Chiyoda-k, Tokyo 01, 〒1018101, JP)
旭化成イーマテリアルズ株式会社 (〒01 東京都千代田区神田神保町一丁目１０５番地 Tokyo, 〒1018101, JP)
旭化成イーマテリアルズ株式会社 (〒01 東京都千代田区神田神保町一丁目１０５番地 Tokyo, 〒1018101, JP)
International Classes:
H01B5/14; C23C18/16; C23C18/28; H01B13/00; H05K1/09; H05K3/00; H05K3/12; H05K3/18; C08J7/04
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (TMI ASSOCIATES, 23rd FloorRoppongi Hills Mori Tower,6-10-1, Roppong, Minato-ku Tokyo 23, 〒1066123, JP)
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