Title:
COMPOSITION FOR FORMING FLEXIBLE DEVICE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/009259
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a composition for forming a flexible device substrate, which enables the achievement of a resin thin film that has excellent properties as a base film for a flexible device substrate such as a flexible display substrate, said resin thin film maintaining excellent properties such as excellent heat resistance, low retardation, excellent flexibility and excellent transparency, while being able to be easily separated from a base material by means of a mechanical separation method (an MD method). [Solution] A composition for forming a flexible device substrate, which contains: a polyimide that is obtained using a tetracarboxylic acid dianhydride component that contains alicyclic tetracarboxylic acid dianhydrides represented by formula (C1) and formula (D1) and a diamine component that contains a fluorene diamine represented by formula (E1); and an organic solvent. (In the formulae, B1 represents a tetravalent group selected from the group consisting of groups represented by formulae (X-1) to (X-11).)
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Inventors:
HSI WAYNE (TW)
HO BANG-CHING (TW)
HO BANG-CHING (TW)
Application Number:
PCT/JP2018/025103
Publication Date:
January 10, 2019
Filing Date:
July 02, 2018
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08L79/08; C08K5/00; H05K1/03
Domestic Patent References:
| WO2017010566A1 | 2017-01-19 |
Foreign References:
| JP2011216535A | 2011-10-27 | |||
| JP2014524512A | 2014-09-22 |
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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