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Patent Searching and Data


Title:
COMPOSITION FOR FORMING HIGHLY ADHESIVE RESIST UNDERLAYER FILM
Document Type and Number:
WIPO Patent Application WO/2013/133088
Kind Code:
A1
Abstract:
[Problem] To provide a composition for forming a resist underlayer film having improved adhesiveness with a resist. [Solution] A composition for forming a resist underlayer film for lithography comprising an organic solvent and a polymer having repeating structural units represented by the formula (1) in the main chain. [Chemical formula 1] (In the formula, R1 is a hydrogen atom or methyl group, Q1 is a group represented by the formula (2) or (3), and v1 and v2 are each independently 0 or 1.) [Chemical formula 2] (In the formula, R2, R3, R5, and R6 are each independently a hydrogen atom or C1-4 linear or branched hydrocarbon group; R4 is a hydrogen atom or methyl group; R7 is a C1-6 linear or branched hydrocarbon group, C1-4 alkoxy group, C1-4 alkylthio group, halogen atom, cyano group or nitro group; w1 is an integer between 0 and 3; w2 is an integer between 0 and 2; and x is an integer between 0 and 3.)

Inventors:
ENDO TAKAFUMI (JP)
SAKAMOTO RIKIMARU (JP)
FUJITANI NORIAKI (JP)
Application Number:
PCT/JP2013/054917
Publication Date:
September 12, 2013
Filing Date:
February 26, 2013
Export Citation:
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Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C08G63/00; G03F7/11; C08G65/40; H01L21/027
Domestic Patent References:
WO2011004721A12011-01-13
Foreign References:
JP2011042645A2011-03-03
JP2009516207A2009-04-16
Attorney, Agent or Firm:
HANABUSA, Tsuneo et al. (JP)
Sepal Tsuneo (JP)
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Claims: