Title:
COMPOSITION FOR FORMING IMPRINT ADHESIVE FILM, ADHESIVE FILM, LAMINATE, METHOD FOR PRODUCING CURED MATERIAL PATTERN, AND METHOD OF MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/159575
Kind Code:
A1
Abstract:
Provided are: a composition for forming an imprint adhesive film having excellent adhesion and wettability; an adhesive film; a laminate; a method for producing a cured material pattern; and a method of manufacturing a circuit board. The composition for forming an imprint adhesive film contains a solvent and a resin having a polymerizable group, wherein the resin has at least one repeating unit derived from a polymerizable compound having a ClogP value of 0 or less, and the solubility of the resin in water at 25°C is at least 1 mass%. The ClogP value is a coefficient indicating the affinity of an organic compound for water and 1-octanol.
Inventors:
SHIMOJU NAOYA (JP)
SHIBUYA AKINORI (JP)
GOTO YUICHIRO (JP)
SHIBUYA AKINORI (JP)
GOTO YUICHIRO (JP)
Application Number:
PCT/JP2018/007122
Publication Date:
September 07, 2018
Filing Date:
February 27, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/027; B29C59/02; C08F2/48
Foreign References:
| JP2014024322A | 2014-02-06 | |||
| JP2010097202A | 2010-04-30 | |||
| JP2014003123A | 2014-01-09 | |||
| JP2013202982A | 2013-10-07 | |||
| JP2012086484A | 2012-05-10 | |||
| JP2013153084A | 2013-08-08 | |||
| JP2009503139A | 2009-01-29 | |||
| JP2016028419A | 2016-02-25 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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