COMPOSITION FOR FORMING INSULATING PROTECTIVE FILM BY OFFSET PRINTING

Title:

COMPOSITION FOR FORMING INSULATING PROTECTIVE FILM BY OFFSET PRINTING

Document Type and Number:

WIPO Patent Application WO/2016/195025

Kind Code:

A1

Abstract:

[Problem] To provide an insulating protective film formation composition for forming an insulating protective film using offset printing, wherein, in a system in which a heat-curable resin is used as the insulating protective film, the curable resin is absorbed into a blanket at an insignificant level. [Solution] The composition for forming an insulating protective film by offset printing contains (A) a high-molecular-weight resin having a crosslinking reactive group and having a mass-average molecular weight of greater than 2 × 104 but not greater than 40 × 104, (B) a solvent having a solubility parameter of more than 8.7 and having a boiling point of 150-350°C, and (C) a solvent having a solubility parameter of 7.0-8.7 and a boiling point of 130°C or higher and less than 250°C.

Inventors:

UCHIDA HIROSHI (JP)
ITO YUJI (JP)
TOBA MASAHIKO (JP)

Application Number:

PCT/JP2016/066433

Publication Date:

December 08, 2016

Filing Date:

June 02, 2016

Export Citation:

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Assignee:

SHOWA DENKO KK (JP)

International Classes:

C09D11/033; B41M1/06; H01B3/30

Foreign References:

JP2008050398A	2008-03-06
JP2006045294A	2006-02-16
JP2006037057A	2006-02-09
JP2015025036A	2015-02-05
JP2014088504A	2014-05-15
JP2009534498A	2009-09-24