Title:
COMPOSITION FOR FORMING LAYER TO BE PLATED, FILM WITH PRECURSOR LAYER OF LAYER TO BE PLATED, FILM WITH PATTERNED LAYER TO BE PLATED, CONDUCTIVE FILM AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2017/154896
Kind Code:
A1
Abstract:
The objective of the present invention is to provide: a composition for forming a layer to be plated, which is capable of forming a layer to be plated having excellent alkali resistance, and which enables the formation of a metal layer on the layer to be plated even in cases where the layer to be plated is formed by light exposure with a small exposure amount; a film with a precursor layer of a layer to be plated; a film with a patterned layer to be plated; a conductive film; and a touch panel.
A composition for forming a layer to be plated according to the present invention contains: a polymer having a group that is interactive with a plating catalyst or a precursor thereof; and a polyfunctional monomer having three or more acrylamide groups or methacrylamide groups.
Inventors:
NARITA TAKESHI (JP)
Application Number:
PCT/JP2017/008974
Publication Date:
September 14, 2017
Filing Date:
March 07, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C23C18/18; B32B27/30; C08F2/44; H05K3/18
Domestic Patent References:
| WO2015190484A1 | 2015-12-17 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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