Title:
COMPOSITION FOR FORMING RELEASE LAYER, AND RELEASE LAYER
Document Type and Number:
WIPO Patent Application WO/2021/132383
Kind Code:
A1
Abstract:
A composition for forming a release layer, including: (A) a polyurea including repeating units represented by formula (1); (B) an acid compound or a salt thereof; (C) a crosslinking agent having a nitrogen atom substituted with a hydroxyalkyl group and/or an alkoxymethyl group; (D) a polymer additive including repeating units represented by formula (a), repeating units represented by formula (b), and repeating units represented by formula (c); and (E) a solvent, wherein the polymer additive (D) is included in the amount of 3-100 parts by mass with respect to 100 parts by mass of the polyurea (A). (In the formulas, RA are each independently a hydrogen atom or a methyl group, RB is a C3 or 4 branched alkyl group in which at least one hydrogen atom is substituted with a fluorine atom, RC is a C6-20 polycyclic alkyl group having one to four hydroxy groups, and RD is a C6-20 polycyclic alkyl group or a C6-12 aryl group.)
Inventors:
SHINDO KAZUYA (JP)
MATSUYAMA MOTONOBU (JP)
FURUKAWA YUKI (JP)
EBARA KAZUYA (JP)
MATSUYAMA MOTONOBU (JP)
FURUKAWA YUKI (JP)
EBARA KAZUYA (JP)
Application Number:
PCT/JP2020/048260
Publication Date:
July 01, 2021
Filing Date:
December 23, 2020
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C08L79/04; B32B7/06; B32B27/00; B32B27/40; C08L33/14; C08L75/02; C09K3/00
Domestic Patent References:
| WO2019022185A1 | 2019-01-31 | |||
| WO2010074075A1 | 2010-07-01 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
Download PDF:
Previous Patent: SPRINKLER HEAD
Next Patent: METHOD FOR MANUFACTURING CONDUCTIVE SUBSTRATE, CONDUCTIVE SUBSTRATE, TOUCH SENSOR, ANTENNA, AND ELEC...
Next Patent: METHOD FOR MANUFACTURING CONDUCTIVE SUBSTRATE, CONDUCTIVE SUBSTRATE, TOUCH SENSOR, ANTENNA, AND ELEC...