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Patent Searching and Data


Title:
COMPOSITION FOR FORMING RELEASING LAYER
Document Type and Number:
WIPO Patent Application WO/2015/152120
Kind Code:
A1
Abstract:
The present invention provides a composition for forming a releasing layer that enables easy separation of a layer or layers from the releasing layer, said layer or layers being formed on top of the releasing layer, while preventing separation at the interface with a glass substrate by maintaining good adhesion to the glass substrate on which the releasing layer is provided. The present invention provides a composition for forming a releasing layer, which contains an organic solvent and a polyamic acid containing 50% by mole or more of a monomer unit represented by formula (1) and having a weight average molecular weight of 10,000 or more. In formula (1), X1 represents a tetravalent organic group; and Y1 represents a divalent group represented by formula (P).

Inventors:
EBARA KAZUYA (JP)
KOIDE YASUYUKI (JP)
SHINDO KAZUYA (JP)
Application Number:
PCT/JP2015/059849
Publication Date:
October 08, 2015
Filing Date:
March 30, 2015
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Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C09D179/08; C08G73/10; C09D5/20
Domestic Patent References:
WO2013047873A12013-04-04
Foreign References:
JP2013153124A2013-08-08
JP2012040836A2012-03-01
JPH04334089A1992-11-20
JP2015074783A2015-04-20
Other References:
SID SYMPOSIUM DIGEST OF TECHNICAL PAPERS, vol. 41, no. 1, May 2010 (2010-05-01), pages 810 - 813
Attorney, Agent or Firm:
YOSHIZAWA, Takao et al. (JP)
Takao Yoshizawa (JP)
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