Title:
COMPOSITION FOR FORMING RESIST UNDERLAYER FILM, UNDERLAYER FILM FOR LITHOGRAPHY, AND PATTERN-FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/188451
Kind Code:
A1
Abstract:
Provided is a composition for forming a resist underlayer film, said composition containing a tellurium-containing compound or a tellurium-containing resin.
Inventors:
TOIDA TAKUMI (JP)
MAKINOSHIMA TAKASHI (JP)
SATO TAKASHI (JP)
ECHIGO MASATOSHI (JP)
MAKINOSHIMA TAKASHI (JP)
SATO TAKASHI (JP)
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2017/017091
Publication Date:
November 02, 2017
Filing Date:
April 28, 2017
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
G03F7/11; C08G8/04; G03F7/26; H01L21/027
Domestic Patent References:
WO2017033943A1 | 2017-03-02 |
Foreign References:
JPH1048831A | 1998-02-20 | |||
JPH0239156A | 1990-02-08 | |||
JPS5219516A | 1977-02-14 | |||
JP2015018223A | 2015-01-29 |
Other References:
See also references of EP 3451059A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Download PDF: