Title:
COMPOSITION FOR FORMING SUBSTRATE FOR FLEXIBLE DEVICES
Document Type and Number:
WIPO Patent Application WO/2017/119450
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a composition for forming a substrate for flexible devices, which forms a resin thin film characterized by having excellent heat resistance and low retardation, especially a resin thin film that is suitable as a substrate for flexible devices, and which forms a resin thin film that absorbs light beams having a specific wavelength, thereby enabling the application of a laser lift-off method.
[Solution] A composition for forming a substrate for flexible devices, which contains a polyimide, titanium dioxide particles having particle diameters of from 3 nm to 200 nm, silicon dioxide particles having an average particle diameter of 100 nm or less as calculated from the specific surface area that is determined by a nitrogen adsorption method, and an organic solvent; and a resin thin film which is formed from this composition for forming a substrate for flexible devices.
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Inventors:
KOYAMA YOSHINARI (JP)
KITA HIROSHI (TW)
YE CHENJIA (TW)
HO BANGCHING (TW)
KITA HIROSHI (TW)
YE CHENJIA (TW)
HO BANGCHING (TW)
Application Number:
PCT/JP2017/000147
Publication Date:
July 13, 2017
Filing Date:
January 05, 2017
Export Citation:
Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C08L79/08; C08G73/10; C08K3/22; C08K3/36; H05K1/03
Domestic Patent References:
| WO2015152178A1 | 2015-10-08 | |||
| WO2013125193A1 | 2013-08-29 | |||
| WO2016158990A1 | 2016-10-06 | |||
| WO2016167296A1 | 2016-10-20 | |||
| WO2016147958A1 | 2016-09-22 |
Foreign References:
| JP2009540092A | 2009-11-19 | |||
| JP2015078254A | 2015-04-23 | |||
| JP2010037425A | 2010-02-18 |
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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