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Title:
COMPOSITION HAVING HIGH FILLER CONTENT AND METHOD FOR PRODUCING MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/190370
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a composition that can be compression-molded at low pressure despite the very low ratio in which an addition-reaction-type polyimide resin is used, the resulting fiber-reinforced molded article having exceptional sliding performance and shape stability during molding. This composition is characterized in containing 40 to 350 parts by weight of functional fibers and 100 to 600 parts by weight of an inorganic microparticulate filler having an average particle diameter of less than 15 μm relative to 100 parts by weight of an addition-reaction type polyimide resin.

Inventors:
ENOKIDO, Toshinori (Corporate Research & Development, 22-4, Okazawa-cho, Hodogaya-ku, Yokohama-sh, Kanagawa 62, 〒2400062, JP)
WATANABE, Kazunobu (Corporate Research & Development, 22-4, Okazawa-cho, Hodogaya-ku, Yokohama-sh, Kanagawa 62, 〒2400062, JP)
SEGAMI, Kouta (Corporate Research & Development, 22-4, Okazawa-cho, Hodogaya-ku, Yokohama-sh, Kanagawa 62, 〒2400062, JP)
KOBAYASHI, Yusuke (Corporate Research & Development, 22-4, Okazawa-cho, Hodogaya-ku, Yokohama-sh, Kanagawa 62, 〒2400062, JP)
Application Number:
JP2018/015222
Publication Date:
October 18, 2018
Filing Date:
April 11, 2018
Export Citation:
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Assignee:
TOYO SEIKAN GROUP HOLDINGS, LTD. (18-1, Higashi-Gotanda 2-chome Shinagawa-k, Tokyo 27, 〒1418627, JP)
International Classes:
C08F299/02; B29C43/34; C08F2/44; C08J5/24; B29K79/00; B29K105/12
Domestic Patent References:
WO2016039485A12016-03-17
WO2009123042A12009-10-08
Foreign References:
JPH02289648A1990-11-29
JPS5989824A1984-05-24
Attorney, Agent or Firm:
ONO, Hisazumi et al. (Nishi-Shimbashi Daiichi Hoki bldg, 5-2 Nishi-Shimbashi 3-chome, Minato-k, Tokyo 03, 〒1050003, JP)
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