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Title:
COMPOSITION AND HEAT CONDUCTING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/195496
Kind Code:
A1
Abstract:
Provided is a composition for forming a heat conducting material, said composition being capable of providing a heat conducting material having excellent heat conduction properties. Also provided is a heat conducting material. The composition comprises a phenol compound represented by general formula (1), an epoxy compound and an inorganic matter.

Inventors:
HAYASHI DAISUKE (JP)
HITOMI SEIICHI (JP)
NIORI TERUKI (JP)
TAKAHASHI KEITA (JP)
Application Number:
PCT/JP2020/007839
Publication Date:
October 01, 2020
Filing Date:
February 26, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G8/20; C08G59/62; C08K3/28; C08K3/38; C08L61/12; C08L63/00
Domestic Patent References:
WO2017131006A12017-08-03
Foreign References:
JPH04174502A1992-06-22
JP2012025800A2012-02-09
JP2017008153A2017-01-12
JP2013216038A2013-10-24
JPH07306317A1995-11-21
JPH07306317A1995-11-21
JP2007002220A2007-01-11
JP2010244038A2010-10-28
JP4592225B22010-12-01
JP2009502529A2009-01-29
JP2001192500A2001-07-17
JP4694929B22011-06-08
JP2012067225A2012-04-05
Other References:
ANGEW. CHEM. INT., vol. 51, 2012, pages 7990 - 7993
C. DESTRADE ET AL., MOL. CRYSR. LIQ. CRYST., vol. 71, 1981, pages 111
"The Chemical Society of Japan, Quarterly Review of Chemistry", CHEMISTRY OF LIQUID CRYSTAL, no. 22, 1994
B. KOHNE ET AL., ANGEW. CHEM. SOC. CHEM. COMM., 1985, pages 1794
J. ZHANG ET AL., J. AM. CHEM. SOC., vol. 116, 1994, pages 2655
ANGEW. CHEM. INT. ED., vol. 51, 2012, pages 7990 - 7993
See also references of EP 3950755A4
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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