COMPOSITION FOR HEAT CONDUCTIVE MATERIALS, HEAT CONDUCTIVE MATERIAL, HEAT CONDUCTIVE SHEET, AND DEVICE WITH HEAT CONDUCTIVE LAYER

WIPO Patent Application WO/2020/158574

A1

The present invention provides a composition for heat conductive materials, which enables the achievement of a heat conductive material that exhibits excellent heat conductivity. The present invention also provides: a heat conductive material which is formed from this composition for heat conductive materials; a heat conductive sheet; and a device with a heat conductive layer. A composition for heat conductive materials according to the present invention contains a phenolic compound, an epoxy compound and an inorganic substance, while satisfying at least one of the following requirements: the phenolic compound contains a spirophenol compound; and the epoxy compound contains a spiroepoxy compound.

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HITOMI SEIICHI (JP)
HAYASHI DAISUKE (JP)
TAKAHASHI KEITA (JP)
NIORI TERUKI (JP)

PCT/JP2020/002344

August 06, 2020

January 23, 2020

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FUJIFILM CORP (JP)

C08G59/20; C08G59/62; C08K3/00; C08L63/00; H01L23/36

JP2017036423A	2017-02-16
JP2015168782A	2015-09-28
JP2016089072A	2016-05-23
JPH0218467A	1990-01-22
JP2016069549A	2016-05-09
JPH1060091A	1998-03-03
JPH07292073A	1995-11-07
JP2002511874A	2002-04-16

NAKASHIMA Junko et al. (JP)

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