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Title:
COMPOSITION FOR HEAT-DISSIPATING MEMBER, HEAT-DISSIPATING MEMBER, ELECTRONIC INSTRUMENT, METHOD FOR PRODUCING COMPOSITION FOR HEAT-DISSIPATING MEMBER, AND METHOD FOR PRODUCING HEAT-DISSIPATING MEMBER
Document Type and Number:
WIPO Patent Application WO/2017/150588
Kind Code:
A1
Abstract:
The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.

Inventors:
FUJIWARA TAKESHI (JP)
INAGAKI JYUNICHI (JP)
HINATSU MASAKO (JP)
AGARI YASUYUKI (JP)
HIRANO HIROSHI (JP)
KADOTA JOJI (JP)
OKADA AKINORI (JP)
Application Number:
PCT/JP2017/008028
Publication Date:
September 08, 2017
Filing Date:
February 28, 2017
Export Citation:
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Assignee:
JNC CORP (JP)
OSAKA MUNICIPAL TECH RES INST (JP)
International Classes:
C09K5/14; C08G59/40; C08G79/00
Domestic Patent References:
WO2016031888A12016-03-03
WO2015170744A12015-11-12
Foreign References:
JP2010116543A2010-05-27
JP2012153846A2012-08-16
JP2006265527A2006-10-05
JP2006265527A2006-10-05
JP5084148B22012-11-28
Other References:
HOUBEN-WYLE: "Methods of Organic Chemistry", GEORG THIEME VERLAG
"Organic Syntheses", JOHN WILY & SONS, INC.
"Organic Reactions", JOHN WILY & SONS INC.
"Comprehensive Organic Synthesis", PERGAMON PRESS
See also references of EP 3425019A4
Attorney, Agent or Firm:
MIYAGAWA, Teiji et al. (JP)
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