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Title:
COMPOSITION FOR HEAT-DISSIPATING MEMBER, HEAT-DISSIPATING MEMBER, ELECTRONIC INSTRUMENT, AND METHOD FOR PRODUCING HEAT-DISSIPATING MEMBER
Document Type and Number:
WIPO Patent Application WO/2017/150589
Kind Code:
A1
Abstract:
This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent 11 and the other end of the second coupling agent 12 are each bonded to a bifunctional or higher silsesquioxane 21 by a curing treatment, as illustrated in Fig. 2, for example; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent 13 and the other end of the second coupling agent 12 are bonded together as illustrated in Fig. 3, for example.

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Inventors:
FUJIWARA TAKESHI (JP)
HATTORI TAKAYUKI (JP)
INAGAKI JYUNICHI (JP)
KUNINOBU TAKAFUMI (JP)
TAKIZAWA KAZUHIRO (JP)
AGARI YASUYUKI (JP)
HIRANO HIROSHI (JP)
KADOTA JOJI (JP)
OKADA AKINORI (JP)
Application Number:
PCT/JP2017/008029
Publication Date:
September 08, 2017
Filing Date:
February 28, 2017
Export Citation:
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Assignee:
JNC CORP (JP)
OSAKA MUNICIPAL TECH RES INST (JP)
International Classes:
C08L83/04; C08G59/32; C08K9/04; C08L63/00; C09K5/14
Domestic Patent References:
WO2016031888A12016-03-03
WO2015170744A12015-11-12
Foreign References:
JP2009013294A2009-01-22
JP2010116543A2010-05-27
JP2012153846A2012-08-16
JP2006265527A2006-10-05
JP2012097207A2012-05-24
JP2006265527A2006-10-05
JPS5013127B11975-05-17
JPS548597B11979-04-17
JP4379120B22009-12-09
JP4483344B22010-06-16
JP5084148B22012-11-28
Other References:
See also references of EP 3425006A4
Attorney, Agent or Firm:
MIYAGAWA, Teiji et al. (JP)
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