Title:
COMPOSITION FOR HEAT INSULATOR, HEAT INSULATOR, AND METHOD FOR MANUFACTURING HEAT INSULATOR
Document Type and Number:
WIPO Patent Application WO/2023/281628
Kind Code:
A1
Abstract:
This method for manufacturing a heat insulator comprises heating, at a heating rate of X (˚C/minute), a composition for a heat insulator containing a thermosetting resin and heat expandable organic hollow particles to cure the composition for a heat insulator, wherein: the heating rate X (°C/minute) is a rate in which the difference between (i) the curing time of the thermosetting resin when the temperature is raised from 30 °C at a heating rate X (°C/minute) using a rheometer or differential scanning calorimetry and (ii) the time until the maximum expansion coefficient of the heat expandable organic hollow particles is achieved when the heat expandable organic hollow particles are heated from 30 °C at a heating rate X (°C/minute) using thermomechanical analysis is at most 5 minutes; and the heating rate X (°C/minute) is at least 20 °C/minute.
Inventors:
MATO YUJI (JP)
TATENO KIICHI (JP)
NISHIKATA HIROMI (JP)
SHIMAZAKI TOSHIKATSU (JP)
TATENO KIICHI (JP)
NISHIKATA HIROMI (JP)
SHIMAZAKI TOSHIKATSU (JP)
Application Number:
PCT/JP2021/025477
Publication Date:
January 12, 2023
Filing Date:
July 06, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08K7/22; C08J5/12; C08J9/16; C08J9/22; C08L101/00; F16L59/00
Domestic Patent References:
| WO2012153579A1 | 2012-11-15 |
Foreign References:
| JP2000344928A | 2000-12-12 | |||
| JPH06322169A | 1994-11-22 | |||
| JP2014009261A | 2014-01-20 | |||
| JP2014040816A | 2014-03-06 | |||
| JP2019157037A | 2019-09-19 | |||
| JP2004536172A | 2004-12-02 | |||
| JP2006199903A | 2006-08-03 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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