Title:
COMPOSITION, LAMINATE FOR UNDERFILL, LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/146659
Kind Code:
A1
Abstract:
Provided are: a composition which has excellent storage stability, coatability and curability and is capable of forming a film having low water absorption and excellent heat resistance; a laminate for underfill; a laminate using same; a method for manufacturing a semiconductor device; and a semiconductor device.
This composition contains a polycarbonate resin, a polymerizable compound and a solvent. The solvent is contained in the composition in an amount of 50% by mass or more, and 50% by mass or more of the solvent is composed of an aprotic solvent having a boiling point of 130°C or more and a molecular weight of 75 or more. It is preferable that the polycarbonate resin has a repeating unit represented by general formula (1). In general formula (1), each of Ar1 and Ar2 independently represents an aromatic group; and L represents a single bond or a divalent linking group.
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Inventors:
KOYAMA ICHIRO (JP)
YOSHIDA KENTA (JP)
YOSHIDA KENTA (JP)
Application Number:
PCT/JP2015/057634
Publication Date:
October 01, 2015
Filing Date:
March 16, 2015
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F2/44; C08K5/103; C08L69/00; G03F7/004; G03F7/032; H01L23/29; H01L23/31
Foreign References:
| JP2001329133A | 2001-11-27 | |||
| JP2012008547A | 2012-01-12 | |||
| JP2002220525A | 2002-08-09 | |||
| JPH0625520A | 1994-02-01 | |||
| JP2002256039A | 2002-09-11 | |||
| JP2001139791A | 2001-05-22 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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