Title:
COMPOSITION, MAGNETIC MATERIAL AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/189325
Kind Code:
A1
Abstract:
The first problem to be addressed by the present invention is to provide a composition which is capable of forming a magnetic material that has excellent magnetic permeability and excellent moisture resistance. The second problem to be addressed by the present invention is to provide a magnetic material and an electronic component. A composition according to the present invention contains magnetic particles, a heterocycle-containing compound, a compound that is selected from the group consisting of epoxy compounds and oxetane compounds, and a dispersant. With respect to this composition, the polar term of the Hansen solubility parameter of the heterocycle-containing compound is 8.0 MPa1/2 or more; and the hydrogen bonding term of the Hansen solubility parameter of the heterocycle-containing compound is 10.0 MPa1/2 or less.
Inventors:
MIYATA TETSUSHI (JP)
Application Number:
PCT/JP2023/008850
Publication Date:
October 05, 2023
Filing Date:
March 08, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01F1/26; C08K3/11; C08K5/34; C08L63/00; C08L71/02
Foreign References:
| JP2021123721A | 2021-08-30 | |||
| JP2021187894A | 2021-12-13 | |||
| JP2013062318A | 2013-04-04 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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