Title:
COMPOSITION FOR METAL BONDING
Document Type and Number:
WIPO Patent Application WO/2014/185073
Kind Code:
A1
Abstract:
Provided is a bonding composition, especially a bonding composition containing metal particles, which is capable of achieving high bonding strength by bonding at a relatively low temperature without the application of a pressure, and which has heat resistance and is thus not susceptible to decrease in the bonding strength due to decomposition or deterioration of a resin component when the service temperature thereof is increased. A bonding composition which is characterized by containing two or more kinds of metal particles having different average particle diameters, an organic component and a dispersant, and which is also characterized in that the particle diameter ratio of the average particle diameter (DS) of metal particles (S) that have the smallest average particle diameter to the average particle diameter (DL) of metal particles (L) that have the largest average particle diameter, namely DS/DL is from 1 × 10-4 to 0.5.
Inventors:
WATANABE TOMOFUMI (JP)
SHIMOYAMA KENJI (JP)
TAKESUE MASAFUMI (JP)
SHIMOYAMA KENJI (JP)
TAKESUE MASAFUMI (JP)
Application Number:
PCT/JP2014/002555
Publication Date:
November 20, 2014
Filing Date:
May 14, 2014
Export Citation:
Assignee:
BANDO CHEMICAL IND (JP)
International Classes:
B22F7/06; B22F1/102; B22F9/24; B82Y30/00; H01B1/00; H01B1/22; B22F1/08
Foreign References:
| JP2012052198A | 2012-03-15 | |||
| JP2011094223A | 2011-05-12 | |||
| JP2008161907A | 2008-07-17 | |||
| JP2008063688A | 2008-03-21 | |||
| JP2012046779A | 2012-03-08 |
Other References:
See also references of EP 2998050A4
Attorney, Agent or Firm:
NAKA, Koichi et al. (JP)
Relations Koichi (JP)
Relations Koichi (JP)
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