Title:
COMPOSITION AND METAL-INSULATING COATING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/158736
Kind Code:
A1
Abstract:
This composition contains a solvent and a polyimide resin precursor and/or a polyimide resin. The polyimide resin precursor and/or polyimide resin contain a compound represented by formula (0) and/or a compound represented by formula (0') and a compound having a functional group that reacts with a terminal cyclized product of the compound represented by formula (0) and/or compound represented by formula (0'). In formula (0) and formula (0'), R' moieties each independently denote a hydrogen atom or an alkyl group. Ra denotes a tetracarboxylic acid residue. Rb denotes a diamine residue. Ra and/or Rb have one linking group having an active hydrogen and/or 1-4 substituent groups having an active hydrogen. p and q denote arbitrary integers.
Inventors:
ECHIGO YU (JP)
AOKI DAI (JP)
SUGIYAMA JIRO (JP)
AOKI DAI (JP)
SUGIYAMA JIRO (JP)
Application Number:
PCT/JP2020/002988
Publication Date:
August 06, 2020
Filing Date:
January 28, 2020
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G73/10; C08L79/08; C09D5/25; C09D179/08; H01B3/30
Foreign References:
| JPS4630499B1 | 1971-09-04 | |||
| JP2017188438A | 2017-10-12 | |||
| JP2016151020A | 2016-08-22 | |||
| JPH05230419A | 1993-09-07 | |||
| JP2000319421A | 2000-11-21 | |||
| JP2001031764A | 2001-02-06 | |||
| JP2019013345A | 2019-01-31 |
Other References:
See also references of EP 3919549A4
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi et al. (JP)
Download PDF: