Title:
COMPOSITION AND METHOD FOR POLISHING BULK SILICON
Document Type and Number:
WIPO Patent Application WO/2011/130072
Kind Code:
A3
Abstract:
The invention provides a polishing composition comprising (a) silica, (b) one or more compounds that increase the removal rate of silicon, (c) one or more tetraalkylammonium salts, and (d) water, wherein the polishing composition has a pH of 7 to 11. The invention further provides a method of polishing a substrate with the polishing composition.
Inventors:
REISS BRIAN (US)
WHITE MICHAEL (US)
JONES LAMON (US)
CLARK JOHN (US)
WHITE MICHAEL (US)
JONES LAMON (US)
CLARK JOHN (US)
Application Number:
PCT/US2011/031354
Publication Date:
February 09, 2012
Filing Date:
April 06, 2011
Export Citation:
Assignee:
CABOT MICROELECTRONICS CORP (US)
REISS BRIAN (US)
WHITE MICHAEL (US)
JONES LAMON (US)
CLARK JOHN (US)
REISS BRIAN (US)
WHITE MICHAEL (US)
JONES LAMON (US)
CLARK JOHN (US)
International Classes:
H01L21/304; B24B37/02
Foreign References:
| US20070090094A1 | 2007-04-26 | |||
| US20070186484A1 | 2007-08-16 | |||
| US6290580B1 | 2001-09-18 | |||
| US20090291559A1 | 2009-11-26 | |||
| US20050178742A1 | 2005-08-18 | |||
| US20100043823A1 | 2010-02-25 |
Other References:
See also references of EP 2559060A4
Attorney, Agent or Firm:
WESEMAN, Steven et al. (870 N. Commons DriveAurora, IL, US)
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