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Title:
COMPOSITION FOR A MOLD FOR INJECTION MOLDING
Document Type and Number:
WIPO Patent Application WO/2011/087097
Kind Code:
A1
Abstract:
Provided is a composition for injection molding. Said composition comprises a mixture containing at least 50% and less than 100% of a first thermoplastic resin, by weight, with the remainder of the mixture comprising at least one additive selected from among: polyoxymethylene, polypropylene, a fatty acid ester, a fatty acid amide, a phthalate, paraffin wax, a microcrystalline wax, a polyethylene wax, a polypropylene wax, carnauba wax, montan wax, a urethane wax, a maleic anhydride modified wax, a polyglycol compound, and a powdered injection molding binder.

Inventors:
MAITANI, Akira (1-1 Toyosu 3-chome, Koto-k, Tokyo 10, 〒1358710, JP)
米谷 彰 (〒10 東京都江東区豊洲三丁目1番1号 株式会社IHI内 Tokyo, 〒1358710, JP)
NAKAGAWA, Katsunori (1-1, Toyosu 3-chome, Koto-k, Tokyo 10, 〒1358710, JP)
中川 勝則 (〒10 東京都江東区豊洲三丁目1番1号 株式会社IHIターボ内 Tokyo, 〒1358710, JP)
Application Number:
JP2011/050568
Publication Date:
July 21, 2011
Filing Date:
January 14, 2011
Export Citation:
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Assignee:
IHI Corporation (1-1 Toyosu 3-chome, Koto-ku Tokyo, 10, 〒1358710, JP)
株式会社IHI (〒10 東京都江東区豊洲三丁目1番1号 Tokyo, 〒1358710, JP)
MAITANI, Akira (1-1 Toyosu 3-chome, Koto-k, Tokyo 10, 〒1358710, JP)
米谷 彰 (〒10 東京都江東区豊洲三丁目1番1号 株式会社IHI内 Tokyo, 〒1358710, JP)
NAKAGAWA, Katsunori (1-1, Toyosu 3-chome, Koto-k, Tokyo 10, 〒1358710, JP)
International Classes:
B29C33/40; B29C45/26; C08K5/10; C08K5/20; C08L23/14; C08L59/02; C08L67/04; C08L91/06; C08L101/00; B22F3/02; B22F3/10; B22F5/10
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (Toranomon Kotohira Tower, 2-8 Toranomon 1-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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Claims: