Title:
COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2016/133108
Kind Code:
A1
Abstract:
Provided is a composition that yields a molded article having excellent heat resistance and furthermore little weight change in relation to fluorine plasma and oxygen plasma exposure in a semiconductor manufacturing step. The composition is characterized in containing a fluorine-containing polymer and a caged silsesquioxane having a specific structure.
Inventors:
MATSUMOTO KAZUYA (JP)
JIKEI MITSUTOSHI (JP)
NISHI KUNIO (JP)
NOGUCHI TSUYOSHI
KAMIYA FUMIHIRO
JIKEI MITSUTOSHI (JP)
NISHI KUNIO (JP)
NOGUCHI TSUYOSHI
KAMIYA FUMIHIRO
Application Number:
PCT/JP2016/054535
Publication Date:
August 25, 2016
Filing Date:
February 17, 2016
Export Citation:
Assignee:
UNIV AKITA (JP)
DAIKIN IND LTD (JP)
DAIKIN IND LTD (JP)
International Classes:
C08L27/12; C08G69/00; C08K5/5419; C08L77/00; C08L83/10
Domestic Patent References:
WO2012133557A1 | 2012-10-04 |
Foreign References:
JP2010262290A | 2010-11-18 | |||
JP2010024400A | 2010-02-04 | |||
US7193015B1 | 2007-03-20 | |||
JPS62275713A | 1987-11-30 | |||
JP2007112977A | 2007-05-10 |
Other References:
KUNIO NISHI ET AL.: "Kago-gata Silsesquioxane o Core to suru Kosedai Hokozoku Polyamide Dendrimer no Gosei to Tokusei Kaiseki", POLYMER PREPRINTS, vol. 63, no. 1, 9 May 2014 (2014-05-09), Japan, pages 287 - 288, XP009505379
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
Patent business corporation Yasutomi international patent firm (JP)
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