Title:
COMPOSITION FOR PARAFFIN PACK
Document Type and Number:
WIPO Patent Application WO/2003/082226
Kind Code:
A1
Abstract:
A composition for paraffinic packs, characterized by comprising a paraffin having a melting point of 35 to 60°C, a solid fat having a melting point exceeding 40°C, and a liquid oil having a melting point of 40°C or lower. The composition for paraffinic packs begins to melt at a lower temperature than conventional paraffinic packs. The composition can hence be used at a temperature in such a range that it does not feel excessively hot. Without necessitating repeated application many times, the composition forms, upon cooling and solidification, a film which is thick and easy to peel off. It further gives an excellent use feeling.
Inventors:
TOYODA RYOICHI (JP)
OYAMA KEIICHI (JP)
HIKITA TAMAKI (JP)
OYAMA KEIICHI (JP)
HIKITA TAMAKI (JP)
Application Number:
PCT/JP2003/003777
Publication Date:
October 09, 2003
Filing Date:
March 27, 2003
Export Citation:
Assignee:
NISSHIN OILLIO LTD (JP)
TOYODA RYOICHI (JP)
OYAMA KEIICHI (JP)
HIKITA TAMAKI (JP)
TOYODA RYOICHI (JP)
OYAMA KEIICHI (JP)
HIKITA TAMAKI (JP)
International Classes:
A61K8/02; A61K8/31; A61K8/37; A61K8/60; A61K8/92; A61Q3/00; A61Q19/00; (IPC1-7): A61K7/00; A61K7/48
Foreign References:
| JPS62289506A | 1987-12-16 | |||
| JPH0399005A | 1991-04-24 | |||
| JP2002302419A | 2002-10-18 | |||
| JP2001322910A | 2001-11-20 | |||
| JP2001322924A | 2001-11-20 |
Attorney, Agent or Firm:
Sakaguchi, Shozo (5-23-19 Nishifun, Funabashi-shi Chiba, JP)
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