Title:
COMPOSITION AND PHOTOSENSITIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/203837
Kind Code:
A1
Abstract:
Provided are: a composition and a photosensitive composition, in which the components thereof (excluding the solvent when the composition or the photosensitive composition contains a solvent) are less apt to excessively decrease in weight even upon heating and in which the inorganic particles are stably dispersed over a long period; and a cured object of the photosensitive composition. The composition comprises a photopolymerizable compound (A) and inorganic particles (B), and the photosensitive composition comprises a photopolymerizable compound (A), inorganic particles (B), and an initiator (C). As the photopolymerizable compound (A), a compound of a specific structure having a group containing a radically polymerizable group is used.
Inventors:
SUGAWARA RYUTARO (JP)
Application Number:
PCT/JP2023/003931
Publication Date:
October 26, 2023
Filing Date:
February 07, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08F20/10; C08F2/44; C08F292/00
Domestic Patent References:
| WO2014119424A1 | 2014-08-07 |
Foreign References:
| JP2010519369A | 2010-06-03 | |||
| JPH1067736A | 1998-03-10 | |||
| JP2008151866A | 2008-07-03 | |||
| JP2008249972A | 2008-10-16 | |||
| JP2006307049A | 2006-11-09 | |||
| JP2015178547A | 2015-10-08 | |||
| JP7097495B1 | 2022-07-07 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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