Title:
COMPOSITION FOR POLISHING GLASS SUBSTRATE, AND POLISHING SLURRY
Document Type and Number:
WIPO Patent Application WO/2012/077693
Kind Code:
A1
Abstract:
This invention provides a polishing slurry that can mitigate roughness of the finished surface and surface unevenness in the fabrication of a glass substrate, and provides a polishing composition used to prepare the polishing slurry. This composition for polishing a glass substrate and the polishing slurry which contains abrasive grains and the polishing composition include components (A), (B), and as required, (C) and/or (D), where (A) is a tetrazole derivative having at least one group selected from a mercapto group, an alkylthio group, and an alkyl group, (B) is water, (C) is a polysaccharide, and (D) is an amine.
Inventors:
HAMASHIMA, Kentaro (5-3 Minatojimaminami-machi 5-chome, Chuo-k, Kobe-shi Hyogo 47, 〒6500047, JP)
浜島 研太郎 (〒47 兵庫県神戸市中央区港島南町５丁目５番３号 株式会社ＭＯＲＥＳＣＯ内 Hyogo, 〒6500047, JP)
浜島 研太郎 (〒47 兵庫県神戸市中央区港島南町５丁目５番３号 株式会社ＭＯＲＥＳＣＯ内 Hyogo, 〒6500047, JP)
Application Number:
JP2011/078231
Publication Date:
June 14, 2012
Filing Date:
November 30, 2011
Export Citation:
Assignee:
MORESCO Corporation (5-3 Minatojimaminami-machi 5-chome, Chuo-ku, Kobe-shi, Hyogo 47, 〒6500047, JP)
株式会社ＭＯＲＥＳＣＯ (〒47 兵庫県神戸市中央区港島南町５丁目５番３号 Hyogo, 〒6500047, JP)
HAMASHIMA, Kentaro (5-3 Minatojimaminami-machi 5-chome, Chuo-k, Kobe-shi Hyogo 47, 〒6500047, JP)
株式会社ＭＯＲＥＳＣＯ (〒47 兵庫県神戸市中央区港島南町５丁目５番３号 Hyogo, 〒6500047, JP)
HAMASHIMA, Kentaro (5-3 Minatojimaminami-machi 5-chome, Chuo-k, Kobe-shi Hyogo 47, 〒6500047, JP)
International Classes:
B24B37/00; C09K3/14; G11B5/84
Attorney, Agent or Firm:
TAMURA, Iwao (9-22, Terauchi 1-chome Toyonaka-shi, Osaka 72, 〒5610872, JP)
Claims: