Title:
COMPOSITION FOR POLISHING, POLISHING METHOD AND METHOD FOR PRODUCING HARD-BRITTLE MATERIAL SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/136177
Kind Code:
A1
Abstract:
A composition for polishing, which is used for polishing of the surface of an object to be polished, said surface containing an oxide of a metal or a semimetal or a composite material of these oxides, and which contains at least water and silica. This composition for polishing is characterized in that: the silica contains small-diameter silica particles having particle diameters of from 20 nm to 70 nm (inclusive) and large-diameter silica particles having particle diameters of from 100 nm to 200 nm (inclusive); the small-diameter silica particles are contained in the composition for polishing in an amount of 2% by weight or more; the large-diameter silica particles are contained in the composition for polishing in an amount of 2% by weight or more; and the value obtained by dividing the average particle diameter of the large-diameter silica particles by the average particle diameter of the small-diameter silica particles is 2 or more.
Inventors:
SERIKAWA MASAYUKI (JP)
TENKOU KYOUSUKE (JP)
AKIYAMA TOMOMI (JP)
ASAI MAIKO (JP)
TENKOU KYOUSUKE (JP)
AKIYAMA TOMOMI (JP)
ASAI MAIKO (JP)
Application Number:
PCT/JP2016/000748
Publication Date:
September 01, 2016
Filing Date:
February 12, 2016
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| WO2013069623A1 | 2013-05-16 |
Foreign References:
| JP2004146780A | 2004-05-20 | |||
| JP2005038924A | 2005-02-10 | |||
| JP2015093932A | 2015-05-18 | |||
| JP2015093931A | 2015-05-18 |
Other References:
See also references of EP 3263670A4
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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