Title:
COMPOSITION FOR PREPARING THERMOSETTING RESIN AND CURED ARTICLE THEREOF, PREPREG INCLUDING CURED ARTICLE, AND METAL FOIL LAMINATED PLATE AND PRINTED WIRING BOARD EMPLOYING PREPREG
Document Type and Number:
WIPO Patent Application WO/2013/019085
Kind Code:
A3
Abstract:
Disclosed are a composition for preparing a thermosetting resin and a cured article thereof, a prepreg including the cured article, and a metal foil laminated plate and a printed wiring board employing the prepreg. The composition for preparing a thermosetting resin comprises an aromatic polyester amide copolymer with excellent flame retardancy having an amine end group and/or a hydroxyl end group, an epoxy resin, and an optional bismaleimide.
Inventors:
KIM MI JEONG (KR)
KIM YANG SEOB (KR)
GU BON HYEOK (KR)
KIM MAHN JONG (KR)
YUN JONG HWA (KR)
KIM YANG SEOB (KR)
GU BON HYEOK (KR)
KIM MAHN JONG (KR)
YUN JONG HWA (KR)
Application Number:
PCT/KR2012/006180
Publication Date:
June 13, 2013
Filing Date:
August 03, 2012
Export Citation:
Assignee:
SAMSUNG FINE CHEMICALS CO LTD (KR)
KIM MI JEONG (KR)
KIM YANG SEOB (KR)
GU BON HYEOK (KR)
KIM MAHN JONG (KR)
YUN JONG HWA (KR)
KIM MI JEONG (KR)
KIM YANG SEOB (KR)
GU BON HYEOK (KR)
KIM MAHN JONG (KR)
YUN JONG HWA (KR)
International Classes:
C08L77/12; B32B15/08; C08G69/44; C08J5/24; C08L63/00; H05K1/03
Foreign References:
| KR20100135540A | 2010-12-27 | |||
| JP2003206392A | 2003-07-22 | |||
| KR20100080084A | 2010-07-08 |
Attorney, Agent or Firm:
Y.P. LEE, MOCK & PARTNERS (13 Eonju-ro 30-gil Gangnam-gu, Seoul 135-971, KR)
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Claims: