Title:
COMPOSITION FOR PROCESSING AID
Document Type and Number:
WIPO Patent Application WO/2006/101089
Kind Code:
A1
Abstract:
A composition for processing aids which comprises fluoropolymers. When added in a small amount to a melt-processable resin, the processing-aid composition can sufficiently reduce the extruding pressure necessary for molding the resin. Even when the processing-aid composition further contains an adhesion inhibitor, the fixability of the adhesion inhibitor to the fluoropolymer particle surface is excellent. The processing-aid composition comprises a fluoropolymer (P) and a fluoropolymer (Q) different from the fluoropolymer (P), and is characterized in that the fluoropolymer (P) is a fluoropolymer having (a) a C4-21 linear or branched fluoroalkyl group, (b) a C4-21 linear or branched fluoroalkenyl group, or (c) a fluoroether group having 1-200 repeating units of at least one kind selected from the group consisting of -C3F6O-, -C2F4O-, and -CF2O-.
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Inventors:
MIYAMORI TSUYOSHI (JP)
KOMIYA YOSHICHIKA (JP)
INUI KUNIHIKO (JP)
KOMIYA YOSHICHIKA (JP)
INUI KUNIHIKO (JP)
Application Number:
PCT/JP2006/305590
Publication Date:
September 28, 2006
Filing Date:
March 20, 2006
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
MIYAMORI TSUYOSHI (JP)
KOMIYA YOSHICHIKA (JP)
INUI KUNIHIKO (JP)
MIYAMORI TSUYOSHI (JP)
KOMIYA YOSHICHIKA (JP)
INUI KUNIHIKO (JP)
International Classes:
C08L101/04; C08L23/00; C08L27/12
Foreign References:
JP2006037085A | 2006-02-09 | |||
JP2002535470A | 2002-10-22 | |||
JP2002053758A | 2002-02-19 | |||
JPH08239521A | 1996-09-17 | |||
JPH03281509A | 1991-12-12 | |||
JPH037745A | 1991-01-14 | |||
JPS60248762A | 1985-12-09 | |||
JPS58103550A | 1983-06-20 |
Attorney, Agent or Firm:
Yasutomi, Yasuo (4-20 Nishinakajima 5-chome, Yodogawa-k, Osaka-shi Osaka 11, JP)
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