COMPOSITION FOR PROCESSING AID

WIPO Patent Application WO/2006/101089

A1

A composition for processing aids which comprises fluoropolymers. When added in a small amount to a melt-processable resin, the processing-aid composition can sufficiently reduce the extruding pressure necessary for molding the resin. Even when the processing-aid composition further contains an adhesion inhibitor, the fixability of the adhesion inhibitor to the fluoropolymer particle surface is excellent. The processing-aid composition comprises a fluoropolymer (P) and a fluoropolymer (Q) different from the fluoropolymer (P), and is characterized in that the fluoropolymer (P) is a fluoropolymer having (a) a C_4-21 linear or branched fluoroalkyl group, (b) a C_4-21 linear or branched fluoroalkenyl group, or (c) a fluoroether group having 1-200 repeating units of at least one kind selected from the group consisting of -C₃F₆O-, -C₂F₄O-, and -CF₂O-.

JP4427084	Stabilized halogen-containing resin composition
JP2021155531	RESIN COMPOSITE AND METHOD FOR PRODUCING RESIN COMPOSITE

MIYAMORI TSUYOSHI (JP)
KOMIYA YOSHICHIKA (JP)
INUI KUNIHIKO (JP)

PCT/JP2006/305590

September 28, 2006

March 20, 2006

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DAIKIN IND LTD (JP)
MIYAMORI TSUYOSHI (JP)
KOMIYA YOSHICHIKA (JP)
INUI KUNIHIKO (JP)

C08L101/04; C08L23/00; C08L27/12

JP2006037085A	2006-02-09
JP2002535470A	2002-10-22
JP2002053758A	2002-02-19
JPH08239521A	1996-09-17
JPH03281509A	1991-12-12
JPH037745A	1991-01-14
JPS60248762A	1985-12-09
JPS58103550A	1983-06-20

Yasutomi, Yasuo (4-20 Nishinakajima 5-chome, Yodogawa-k, Osaka-shi Osaka 11, JP)

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