COMPOSITION FOR PRODUCING ORGANIC SEMICONDUCTOR DEVICES

Title:

COMPOSITION FOR PRODUCING ORGANIC SEMICONDUCTOR DEVICES

Document Type and Number:

WIPO Patent Application WO/2017/212882

Kind Code:

A1

Abstract:

A composition for producing organic semiconductor devices is provided which is capable of stably forming organic semiconductor devices having high carrier mobility. The composition for producing organic semiconductor devices includes 2, 3-dihydrobenzofuran as a solvent, and an organic semiconductor material. The moisture content of the solvent is not more than 0.25 wt%. The organic semiconductor material is at least one compound selected from the group consisting of compounds represented by formula (1-1), compounds represented by formula (1-2), compounds represented by formula (1-3), compounds represented by formula (1-4), compounds represented by formula (1-5), and compounds represented by formula (1-6) (in the formulae: X1 and X2 are the same or different, and each represent an oxygen atom, a sulfur atom, or a selenium atom; m represents 0 or 1; n1 and n2 are the same or different, and each represent 0 or 1; R1 and R2 are the same or different, and each represent a fluorine atom, a C1-20 alkyl group, a C6-13 aryl group, a pyridyl group, a furyl group, a thienyl group, or a thiazolyl group; one or more of the hydrogen atoms included in the alkyl group may be substituted with fluorine atoms; and one or more of the hydrogen atoms included in the aryl group, the pyridyl group, the furyl group, the thienyl group, and the thiazolyl group may be substituted with fluorine atoms or C1-10 alkyl groups).

Inventors:

YOKOO TAKESHI (JP)
SUZUKI YOUJI (JP)
AKAI YASUYUKI (JP)

Application Number:

PCT/JP2017/018473

Publication Date:

December 14, 2017

Filing Date:

May 17, 2017

Export Citation:

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Assignee:

DAICEL CORP (JP)

International Classes:

H01L51/05; H01L51/30

Domestic Patent References:

WO2015076171A1	2015-05-28
WO2014136827A1	2014-09-12
WO2013125599A1	2013-08-29

Foreign References:

JP2011134757A	2011-07-07
JP2003234522A	2003-08-22
JP2014110347A	2014-06-12

Other References: