COMPOSITION FOR REFRACTORY BRICK, REFRACTORY BRICK, AND METHOD FOR PRODUCING REFRACTORY BRICK

Title:

COMPOSITION FOR REFRACTORY BRICK, REFRACTORY BRICK, AND METHOD FOR PRODUCING REFRACTORY BRICK

Document Type and Number:

WIPO Patent Application WO/2011/093020

Kind Code:

A1

Abstract:

Disclosed is a composition that is for refractory brick and that combines a binding agent for binding and a coated refractory aggregate prepared by coating the surface of a refractory aggregate with a coating layer comprising a binding agent for coating. Because the surface of the refractory aggregate is coated with the coating layer comprising the binding agent for coating, the binding agent for binding is able to bond the refractory aggregate together via the coating layer comprising the binding agent for coating, and it is possible to solidly bond the refractory aggregate together by means of the bond between both binding agents. Also, it is possible to form a char layer adhered to the surface of the refractory aggregate by means of the binding agent for coating on the surface of the refractory aggregate being fired. This char layer exerts an effect as a cushioning layer with respect to sudden heating.

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Inventors:

IDE, Isamu (5, Chikkou-shinmachi 2-cho, Nishi-ku, Sakai-sh, Osaka 31, 〒5928331, JP)
井出　勇 (〒31 大阪府堺市西区築港新町２丁５番地リグナイト株式会社内 Osaka, 〒5928331, JP)
SEKI, Toru (5, Chikkou-shinmachi 2-cho, Nishi-ku, Sakai-sh, Osaka 31, 〒5928331, JP)

Application Number:

JP2011/000168

Publication Date:

August 04, 2011

Filing Date:

January 14, 2011

Export Citation:

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Assignee:

LIGNYTE CO., LTD. (5 Chikkou-shinmachi 2-cho, Nishi-ku Sakai-sh, Osaka 31, 〒5928331, JP)
リグナイト株式会社 (〒31 大阪府堺市西区築港新町２丁５番地 Osaka, 〒5928331, JP)
IDE, Isamu (5, Chikkou-shinmachi 2-cho, Nishi-ku, Sakai-sh, Osaka 31, 〒5928331, JP)
井出　勇 (〒31 大阪府堺市西区築港新町２丁５番地リグナイト株式会社内 Osaka, 〒5928331, JP)

International Classes:

C04B35/00; B22D11/10; B22D41/02; C04B35/043; C04B35/101; C04B35/66; F27D1/00

Attorney, Agent or Firm:

MORI, Yoshiaki et al. (Room 911, Osaka-Ekimae Dai-4 Bldg.11-4, Umeda 1-chome,Kita-ku, Osaka-shi, Osaka 01, 〒5300001, JP)

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