Title:
COMPOSITION FOR SHIELDING ELECTROMAGNETIC WAVE
Document Type and Number:
WIPO Patent Application WO/1984/000555
Kind Code:
A1
Abstract:
A composition for shielding electromagnetic wave, which is a mixture of at least one member selected from the group consisting of plasticized vinyl chloride resin and acrylonitrile/butadiene/styrene resin and copper or copper alloy fibers of 1 to 100 mum in diameter and 0.5 to 10 mm in length, the content of said fibers being 30 to 70 wt. %. This composition shows excellent electromagnetic wave-shielding properties and injection molding properties.
Inventors:
ITO HIROTAKA (JP)
KUSUI AKIO (JP)
KUSUI AKIO (JP)
Application Number:
PCT/JP1983/000238
Publication Date:
February 16, 1984
Filing Date:
July 25, 1983
Export Citation:
Assignee:
DAINICHI NIPPON CABLES LTD (JP)
International Classes:
H01R13/648; C08K3/08; C08K7/06; C08L55/02; H01B1/22; H01B7/00; H01B7/17; H01B7/18; H02G15/103; H05K9/00; (IPC1-7): C08L27/06; C08K7/02; C08L55/02; H01B7/18
Other References:
"Plastics Times" No. 1727, July 12, 1982, Chuo Sangyo Shinko Center Kabushiki Kaisha Hakko, page 1 upper part of left column
Patent Laid-Open No. 46254/1979, page 3, left column, lines 19 to 21
Patent Laid-Open No. 46253/1979, page 4, right column, lines 14 to 16
See also references of EP 0113785A4
Patent Laid-Open No. 46254/1979, page 3, left column, lines 19 to 21
Patent Laid-Open No. 46253/1979, page 4, right column, lines 14 to 16
See also references of EP 0113785A4
Download PDF: