Title:
COMPOSITION FOR SINTER BONDING, SHEET FOR SINTER BONDING, AND DICING TAPE HAVING SHEET FOR SINTER BONDING
Document Type and Number:
WIPO Patent Application WO/2019/092960
Kind Code:
A1
Abstract:
This composition for sinter bonding includes sintered particles that contain an electrically conductive metal. The average grain size of the sintered particles is 2 μm or less, and the ratio of particles having a grain size of 100 nm or less in the sintered particles is 80 mass% or greater. This sheet (10) for sinter bonding is provided with an adhesive layer formed from such a composition for sinter bonding. This dicing tape (X) having a sheet for sinter bonding is provided with such a sheet (10) for sinter bonding and a dicing tape (20). The dicing tape (20) has a layered structure including a substrate (21) and an adhesive agent layer (22), and the sheet (10) for sinter bonding is positioned on the adhesive agent layer (22) of the dicing tape (20). This composition for sinter bonding, sheet for sinter bonding, and dicing tape having a sheet for sinter bonding are suitable for realizing sinter bonding using high-density sintered layers under low-load conditions.
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Inventors:
ICHIKAWA TOMOAKI (JP)
SUGO YUKI (JP)
SHIMODA MAYU (JP)
MITA RYOTA (JP)
SUGO YUKI (JP)
SHIMODA MAYU (JP)
MITA RYOTA (JP)
Application Number:
PCT/JP2018/032290
Publication Date:
May 16, 2019
Filing Date:
August 31, 2018
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B22F1/052; B22F1/054; B22F1/102; C09J7/35; C09J7/38; C09J11/04; C09J201/00; H01L21/52
Domestic Patent References:
| WO2017057485A1 | 2017-04-06 | |||
| WO2008065728A1 | 2008-06-05 |
Foreign References:
| JP2011094223A | 2011-05-12 | |||
| JP2013091835A | 2013-05-16 | |||
| JP2016121329A | 2016-07-07 | |||
| US20170306170A1 | 2017-10-26 | |||
| JP2013039580A | 2013-02-28 | |||
| JPS60196956A | 1985-10-05 |
Other References:
See also references of EP 3711879A1
Attorney, Agent or Firm:
GOTO & CO. (JP)
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