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Patent Searching and Data


Title:
COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE, AND PRODUCTION METHOD FOR MODIFIED INORGANIC PARTICLES
Document Type and Number:
WIPO Patent Application WO/2023/243613
Kind Code:
A1
Abstract:
The present invention provides a composition that includes: at least one type of compound selected from the group that consists of compounds represented by formula (1-1) and compounds represented by formula (1-2); inorganic particles; and a dispersion medium. The present invention also provides: a thermally conductive material formed from the composition; a device that comprises the thermally conductive material; and a production method for modified inorganic particles.

Inventors:
TOYA EITARO (JP)
Application Number:
PCT/JP2023/021782
Publication Date:
December 21, 2023
Filing Date:
June 12, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08L101/00; C08F290/14; C08G63/08; C08K3/28; C08L67/04; C08L79/08
Domestic Patent References:
WO2014021100A12014-02-06
Foreign References:
JP2018155853A2018-10-04
JPS5277162A1977-06-29
JP2013108060A2013-06-06
JP2022018508A2022-01-27
Attorney, Agent or Firm:
SIKs & Co. (JP)
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