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Patent Searching and Data


Title:
COMPOSITION FOR THICK FILM RESISTOR, THICK FILM RESISTANCE PASTE, AND THICK FILM RESISTOR
Document Type and Number:
WIPO Patent Application WO/2019/059290
Kind Code:
A1
Abstract:
[Problem] To provide: a composition for a thick film resistor having a high rate of decrease in resistance value as an amount of change in a resistance value that can be adjusted by an adjustment method using pulse trimming when forming a resistor; a thick film resistance paste; and a thick film resistor. [Solution] This composition for a thick film resistor contains ruthenium oxide-based conductive powder comprising mixed powder of ruthenium oxide and lead-ruthenium, and glass frit, and further contains silver powder of 16-33 mass%, wherein, when a thick film resistor is formed by sintering a thick film resistance paste to which an organic vehicle is added, the rate of decrease in resistance value of the thick film resistor, which can be adjusted by an adjustment method using pulse trimming, is set to be larger than 5%.

Inventors:
NAGANO TAKAHITO (JP)
Application Number:
PCT/JP2018/034854
Publication Date:
March 28, 2019
Filing Date:
September 20, 2018
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
H01B1/20; B22F1/12; H01B1/00; H01B1/08; H01B1/22; H01B5/14; H01C7/00; B22F9/24
Foreign References:
JPH039501A1991-01-17
US5534194A1996-07-09
JPH0645102A1994-02-18
Attorney, Agent or Firm:
SHINOHARA & COMPANY INTERNATIONAL PATENT FIRM (JP)
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