COMPOSITION FOR USE AS MATERIAL OF ELECTRICAL OR ELECTRONIC PARTS, AND CURED PRODUCT THEREOF

WIPO Patent Application WO/2012/029249

A1

The purpose of the present invention is to provide both a low-viscosity and fast-curable composition for use as the material of electrical or electronic parts and a cured product which exhibits excellent heat resistance and mechanical properties and which, even under high-temperature and high-humidity conditions, attains excellent electrical insulation and rarely causes the discoloration of electrodes. The present invention pertains to a curable composition which comprises (A) a vinyl polymer that has at least one terminal (meth)acryloyl group per molecule, (B) 25 to 45wt% of a vinyl monomer that has a (meth)acryloyl group, and (C) an initiator.

WO/2002/022715	A METHOD OF IMPROVING THE MELT PROCESSING OF THERMOPLASTIC POLYMERS AND COMPOSITIONS PRODUCED THEREBY
JPH11189628	AROMATIC VINYL RESIN MATERIAL AND MOLDED PRODUCT THEREFROM
WO/1998/033844	PRODUCT FORMED FROM AN OLEFIN POLYMER

ICHIRYU YOSHIKATSU (JP)
KOTANI JUN (JP)

PCT/JP2011/004668

March 08, 2012

August 23, 2011

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KANEKA CORP (JP)
ICHIRYU YOSHIKATSU (JP)
KOTANI JUN (JP)

C08F290/04; C08F2/50

WO2007004584A1

2007-01-11

JP2010126680A	2010-06-10
JP2006265488A	2006-10-05
JP2007077182A	2007-03-29
JPH08272208A	1996-10-18
JP2000072816A	2000-03-07
JP2000095826A	2000-04-04
JP2007077182A	2007-03-29
JP2005232419A	2005-09-02
JP2006291073A	2006-10-26
JP2004203932A	2004-07-22
JPH03111402A	1991-05-13
JPH05194619A	1993-08-03
JPH0469659B2	1992-11-06
JPH07108928B2	1995-11-22
JPS63254149A	1988-10-20
JPS6422904A	1989-01-25
JP2000154212A	2000-06-06
JP2004059783A	2004-02-26
JP2000191912A	2000-07-11

See also references of EP 2612873A4

KANEKA CORPORATION (JP)
KANEKA Co. (JP)

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