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Patent Searching and Data


Title:
COMPOSITION FOR USE IN FORMING LAYER TO BE PLATED, METHOD FOR MANUFACTURING METAL PATTERN MATERIAL, AND NOVEL POLYMER
Document Type and Number:
WIPO Patent Application WO/2012/032905
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a composition that is for use in forming a layer to be plated and that can form such a layer which is developable with an aqueous solution and exhibits excellent developability and which, even when exposed to high-temperature and high-humidity environment, exhibits high tight adhesion to a plating film (metal film) formed on a surface thereof. This composition contains a polymer which comprises at least units represented by formula (A) and units represented by formula (B).

Inventors:
MATSUMURA TOKIHIKO (JP)
Application Number:
JP2011/068578
Publication Date:
March 15, 2012
Filing Date:
August 16, 2011
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
MATSUMURA TOKIHIKO (JP)
International Classes:
C23C18/18; C08F8/00; C08F299/00; G03F7/038; G03F7/40; H05K1/03; H05K3/18
Foreign References:
JP2010084196A2010-04-15
JP2010077322A2010-04-08
JP2009280904A2009-12-03
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
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Claims: