Title:
COMPOSITION FOR USE IN PHOTOELECTRONIC COMPONENT PACKAGING, PACKAGING STRUCTURE, AND PHOTOELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2022/037311
Kind Code:
A1
Abstract:
A composition for use in photoelectronic component packaging, a packaging structure, and a photoelectronic component, comprising 10% to 70% of a photocurable monomer; 10% to 70% of a monofunctional or trifunctional silicon-containing monomer; and 0.5% to 10% of an initiator. The use of the silicon-containing monomer, on the one hand, because of the strong distensibility of the Si-O-Si chain segment of self, provides a stress dispersing effect upon impact, reduces internal stress, and increases the mechanical performance of the organic packaging composition; and on the other hand, effectively increases the thermal performance and hydrophobicity of the organic packaging composition. A film packaging for use on the photoelectronic component effectively increases the service life of the component.
Inventors:
WU CHAOXIN (CN)
LEI TING (CN)
LI LU (CN)
ZHOU GUIJIANG (CN)
LIU YUHONG (CN)
LEI TING (CN)
LI LU (CN)
ZHOU GUIJIANG (CN)
LIU YUHONG (CN)
Application Number:
PCT/CN2021/105556
Publication Date:
February 24, 2022
Filing Date:
July 09, 2021
Export Citation:
Assignee:
XIAN SMART MAT CO LTD (CN)
International Classes:
C08F220/18; H01L51/54; C08F222/20; C08F230/08; H01L31/048; H01L51/00; H01L51/50; H01L51/52
Foreign References:
| CN111933823A | 2020-11-13 | |||
| CN102299118A | 2011-12-28 | |||
| CN111171729A | 2020-05-19 | |||
| CN111205815A | 2020-05-29 | |||
| KR20170003169A | 2017-01-09 | |||
| CN101928370A | 2010-12-29 | |||
| CN110128783A | 2019-08-16 |
Attorney, Agent or Firm:
XI'AN NEW POWER INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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