Title:
COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/163025
Kind Code:
A1
Abstract:
The present invention provides a composition that contains, in prescribed ranges, tetrafluoroethylene-based polymer particles and spheroidal and non-spheroidal boron nitride particles having a prescribed average particle diameter, that has excellent dispersibility, and that makes it possible to form a molded article which has low linear expansion coefficient, low dielectric constant, and low dielectric loss tangent, and which has excellent thermal conductivity, excellent bending tolerance, and excellent adhesiveness. Provided is a composition comprising: tetrafluoroethylene-based polymer particles; spheroidal boron nitride particles that have an average particle diameter of 5-40 μm; and non-spheroidal boron nitride particles that have an average particle diameter of less than 15 μm, wherein the mass ratio of the non-spheroidal boron nitride particles with respect to the total mass of the spheroidal boron nitride particles and the non-spheroidal boron nitride particles is less than 30%.
Inventors:
MITSUNAGA ATSUMI (JP)
Application Number:
PCT/JP2023/006416
Publication Date:
August 31, 2023
Filing Date:
February 22, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C08L27/18; C08J3/20; C08K3/38; C08K7/18
Domestic Patent References:
| WO2021112164A1 | 2021-06-10 | |||
| WO2021010320A1 | 2021-01-21 | |||
| WO2020045260A1 | 2020-03-05 |
Foreign References:
| JP2021181382A | 2021-11-25 |
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
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