Title:
COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/238797
Kind Code:
A1
Abstract:
Provided is a composition that includes a fluoroelastomer or a hot-melt tetrafluoroethylene polymer, the composition being suitable for use as a thermal interface material and making it possible to form molded articles, such as sheets, that have excellent mechanical properties and heat resistance, have a low linear expansion coefficient, dielectric constant, and dielectric tangent, and, in particular, have excellent thermal conductivity while still being electrically insulating. A composition according to the present invention includes a fluoroelastomer or a hot-melt tetrafluoroethylene polymer that has a melting temperature of above 100°C but not above 325°C, a thermally conductive inorganic filler that has an average particle diameter of at least 10 μm, and a thermally conductive filler that has an average particle diameter of less than 2 μm.
Inventors:
KUWAHARA YUICHI (JP)
MITSUNAGA ATSUMI (JP)
KAMO HIROMICHI (JP)
MITSUNAGA ATSUMI (JP)
KAMO HIROMICHI (JP)
Application Number:
PCT/JP2023/020651
Publication Date:
December 14, 2023
Filing Date:
June 02, 2023
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
C08J5/18; C08L27/12; C08K3/013; C08K3/04; C08K3/08; C08K3/22; C08K3/28; C08K3/34; C08K3/38; C08K7/06; C08L27/18
Domestic Patent References:
| WO2007135875A1 | 2007-11-29 |
Foreign References:
| JP2014185294A | 2014-10-02 | |||
| JP2008524028A | 2008-07-10 | |||
| JPH07102274A | 1995-04-18 | |||
| JP2015048414A | 2015-03-16 | |||
| JP2011195710A | 2011-10-06 | |||
| JP2007070492A | 2007-03-22 | |||
| JP2019089957A | 2019-06-13 | |||
| JP2022098733A | 2022-07-04 |
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
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