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Title:
COMPOUND, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, AND PATTERN FORMATION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING SAME, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/156524
Kind Code:
A1
Abstract:
Provided are a compound, actinic-ray-sensitive or radiation-sensitive resin composition, resist film, and pattern formation method, a method for manufacturing an electronic device using the same, and an electronic device, whereby high resolution and exposure latitude, and good pattern shape are realized in a minute (e.g., a line width or space width of 50 nm or less) region of pattern formation by an actinic-ray-sensitive or radiation-sensitive resin composition containing a compound represented by general formula (1) or (2). In the general formulas, R1-R5 each independently represent an organic group. At least two of R1-R3 may bond with each other and form a ring. At least one of R1-R3 and at least one of R4 and R5 each has at least one type of group selected from the group consisting of groups represented by general formulas (I)-(IV) described in the specification. Z- represents a non-nucleophilic anion.

Inventors:
YOKOKAWA NATSUMI (JP)
TAKIZAWA HIROO (JP)
HIRANO SHUJI (JP)
NIHASHI WATARU (JP)
TSUBAKI HIDEAKI (JP)
Application Number:
PCT/JP2014/055678
Publication Date:
October 02, 2014
Filing Date:
March 05, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07C381/12; C08F12/30; C08F20/38; C08K5/36; C08L101/00; G03F7/038; G03F7/039; G03F7/32
Foreign References:
JP2012237983A2012-12-06
JP2011006400A2011-01-13
JP2013033229A2013-02-14
JP2012242657A2012-12-10
JP2012247502A2012-12-13
JP2006241384A2006-09-14
JP2004250427A2004-09-09
JP2013182023A2013-09-12
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
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