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Title:
COMPOUND, BINDER RESIN, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND DISPLAY DEVICE COMPRISING BLACK BANK FORMED USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/091222
Kind Code:
A1
Abstract:
The present application relates to a compound of chemical formula 1, a binder resin, a negative-type photosensitive resin composition, and a display device comprising a black bank formed using same.

Inventors:
AN JUNHYUN (KR)
PARK EUN SEOK (KR)
KIM YONGMI (KR)
LIM MINYOUNG (KR)
PARK SUMIN (KR)
Application Number:
PCT/KR2020/015316
Publication Date:
May 14, 2021
Filing Date:
November 04, 2020
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C07C217/80; G03F7/004; G03F7/028; G03F7/032; G03F7/038; G03F7/105
Domestic Patent References:
WO2018181311A12018-10-04
WO2019065902A12019-04-04
Foreign References:
US4882370A1989-11-21
KR20180101045A2018-09-12
Other References:
GOTRO JEFFREY: "Thermoset Cure Chemistry Part 3: Epoxy Curing Agents", POLYMER INNOVATION BLOG, 17 March 2014 (2014-03-17), pages 1 - 9, XP055809515, Retrieved from the Internet [retrieved on 20210601]
PRAMANIK MONOJ ET AL: "Cure kinetics of several epoxy-amine systems at ambient and high temperatures", JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH, SPRINGER NEW YORK LLC, US, vol. 11, no. 2, 24 January 2014 (2014-01-24), US, pages 143 - 157, XP035364573, ISSN: 1547-0091, DOI: 10.1007/s11998-013-9565-4
XIONG YUANQIN ET AL: "Crystal structure, curing kinetics, and thermal properties of bisphenol fluorene epoxy resin", JOURNAL OF APPLIED POLYMER SCIENCE, JOHN WILEY & SONS, INC., US, vol. 118, no. 2, 1 January 2010 (2010-01-01), US, pages 827 - 833, XP055809520, ISSN: 0021-8995, DOI: 10.1002/app.32248
Attorney, Agent or Firm:
CHOI, Hee-Kyeong et al. (KR)
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