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Title:
COMPOUND CONTAINING PHENOLIC HYDROXY GROUP, COMPOSITION CONTAINING PHENOLIC HYDROXY GROUP, RESIN CONTAINING (METH)ACRYLOYL GROUP, CURABLE COMPOSITION AND CURED PRODUCT THEREOF, AND RESIST MATERIAL
Document Type and Number:
WIPO Patent Application WO/2014/084097
Kind Code:
A1
Abstract:
Provided are: a resin containing a (meth)acryloyl group, which has excellent heat resistance; and a compound containing a phenolic hydroxyl group, which can be used as a raw material for the resin. A compound containing a phenolic hydroxyl group, which has a molecular structure represented by general formula (1) [wherein R1, R2 and R3 independently represent an alkyl group having 1 to 8 carbon atoms; m and n independently represent an integer of 1 to 4; p represents an integer of 0 to 4; V represents a hydrogen atom, a (meth)acryloyloxy group or a hydroxy group; and W, X and Y independently represent a (meth)acryloyloxy group or a hydroxy group], wherein at least one of V, W, X and Y represents a hydroxy group and at least one of V, W, X and Y represents a (meth)acryloyloxy group.

Inventors:
SHIN DONGMI (JP)
IMADA TOMOYUKI (JP)
KAGE TAKAKAZU (JP)
Application Number:
PCT/JP2013/081265
Publication Date:
June 05, 2014
Filing Date:
November 20, 2013
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F20/30; C07C67/14; C07C67/297; C07C69/54; C08F299/02; C08G8/30; G03F7/027
Domestic Patent References:
WO2014017236A12014-01-30
WO2006132139A12006-12-14
Foreign References:
JP2004054002A2004-02-19
JPH0741531A1995-02-10
JPH0291113A1990-03-30
JP2002003563A2002-01-09
JPS635053A1988-01-11
JPH04211257A1992-08-03
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
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