Title:
COMPOUND, CURABLE RESIN COMPOSITION AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/176703
Kind Code:
A1
Abstract:
The present invention provides a compound which is represented by formula (1). In the formula, R1 represents a hydrogen atom or a methyl group; each of R2 to R5 independently represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkanoyloxy group having 1 to 10 carbon atoms, an alkoxycarbonyl group having 1 to 10 carbon atoms, an alkyl amide group having 1 to 10 carbon atoms, a halogen atom, a hydroxyl group, a nitro group or a nitryl group; A1 represents an alkylene group having 1 to 20 carbon atoms; and A2 represents a propylene group or an isopropylene group.
Inventors:
MORI YASUYUKI (JP)
ENDO TAKESHI (JP)
OKANO IPPEI (JP)
OGAWA RYO (JP)
TAMASO KEN-ICHI (JP)
ENDO TAKESHI (JP)
OKANO IPPEI (JP)
OGAWA RYO (JP)
TAMASO KEN-ICHI (JP)
Application Number:
PCT/JP2023/009179
Publication Date:
September 21, 2023
Filing Date:
March 09, 2023
Export Citation:
Assignee:
ADEKA CORP (JP)
International Classes:
C07D405/12; C08G59/18; C08L63/00
Foreign References:
| JP2011213683A | 2011-10-27 | |||
| JP2005053856A | 2005-03-03 |
Other References:
CHIEN-PEN LO: " Reactions of N-Chloromethylphthalimide with Nucleophilic Divalent Sulfur Compounds", JOURNAL OF ORGANIC CHEMISTRY, vol. 26, 1 September 1961 (1961-09-01), pages 3591 - 3593, XP093092808
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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