COMPOUND, DISSOLUTION INHIBITOR, POSITIVE-WORKING RESIST COMPOSITION, AND METHOD FOR RESIST PATTERN FORMATION

WIPO Patent Application WO/2006/112446

A1

This invention provides a positive-working resist composition, which uses a low-molecular material as a base component and can form a high-resolution resist pattern, and a method for resist pattern formation, a compound suitable for the positive-working resist composition, and a dissolution inhibitor. The compound is a nonpolymer having a molecular weight of 500 to 3000 and is decomposed by the action of an acid to give two or more molecules of a decomposition product having a molecular weight of not less than 200. The dissolution inhibitor contains the compound. The positive-working resist composition comprises the compound and an acid generating agent component. In the method for resist pattern formation, the positive-working resist composition is used.

SHIONO DAIJU (JP)
HIRAYAMA TAKU (JP)
OGATA TOSHIYUKI (JP)
MATSUMARU SHOGO (JP)
HADA HIDEO (JP)

PCT/JP2006/308080

October 26, 2006

April 17, 2006

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TOKYO OHKA KOGYO CO LTD (JP)
SHIONO DAIJU (JP)
HIRAYAMA TAKU (JP)
OGATA TOSHIYUKI (JP)
MATSUMARU SHOGO (JP)
HADA HIDEO (JP)

C07J9/00; G03F7/004; G03F7/039

WO2004051372A2	2004-06-17
WO2005100412A1	2005-10-27

US20020025495A1	2002-02-28
JP2001142217A	2001-05-25
JP2006078744A	2006-03-23

KIM J. ET AL.: "Novel Molecular Resist Based on Derivative of Cholic Acid", CHEMISTRY LETTERS, vol. 31, no. 10, 2002, pages 1064, XP003006904

Tanai, Sumio (Yaesu Chuo-ku, Tokyo 53, JP)

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