Title:
COMPOUND ELECTRIC CONTACT
Document Type and Number:
WIPO Patent Application WO/2017/119356
Kind Code:
A1
Abstract:
Provided is a compound electric contact that enables integration with a pedestal section at a higher bonding strength compared with conventional levels even when a high-oxide-based silver alloy is used as a contact material. According to the present invention, a compound electric contact (1) is provided with: a contact section (2a, 6a) at which contact opening/closing is performed; and a pedestal section (3) which is integrated with the contact section to form a portion to be fixed to a base metal, wherein silver or a silver alloy is used as a contact material for forming the contact section (2a, 6a), and brass is used as a pedestal material for forming the pedestal section.
Inventors:
OTSUKI MASATO (JP)
YOSHIDA AKIRA (JP)
SEKINO YASUHIRO (JP)
SHIBUTA MASAYUKI (JP)
YOSHIDA AKIRA (JP)
SEKINO YASUHIRO (JP)
SHIBUTA MASAYUKI (JP)
Application Number:
PCT/JP2016/088846
Publication Date:
July 13, 2017
Filing Date:
December 27, 2016
Export Citation:
Assignee:
NIDEC SANKYO CMI CORP (JP)
International Classes:
H01H1/025; H01H1/023; H01H11/04
Foreign References:
| JPS5736727B2 | 1982-08-05 | |||
| JPS5159382A | 1976-05-24 |
Attorney, Agent or Firm:
SHIMIZU Chiharu (JP)
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