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Patent Searching and Data


Title:
COMPOUND FOR ENHANCING ADHESION PROPERTIES OF POLYIMIDE RESIN AND POLYIMIDE COPOLYMER PRODUCED USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/066203
Kind Code:
A1
Abstract:
The present invention provides a novel polyimide resin adhesion enhancer having a fluorene framework, wherein a polyimide film produced using same exhibits conventional properties such as heat resistance and mechanical properties, and maintains adhesion with a carrier substrate while not being affected with respect to retardation even during a high-temperature process.

Inventors:
YUN CHEOLMIN (KR)
KIM KYUNGJUN (KR)
Application Number:
PCT/KR2018/007267
Publication Date:
April 04, 2019
Filing Date:
June 27, 2018
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C07F7/18; C08G73/10; C08J5/18; C08K5/544; C08L79/08
Foreign References:
US4923948A1990-05-08
KR20160097685A2016-08-18
KR20170057458A2017-05-24
US20150368402A12015-12-24
US5061809A1991-10-29
KR20170125671A2017-11-15
KR20180072773A2018-06-29
Other References:
See also references of EP 3567046A4
Attorney, Agent or Firm:
KIM, Aera (KR)
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