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Patent Searching and Data


Title:
COMPOUND, HEAT-CURABLE RESIN COMPOSITION, AND HEAT-CURABLE SHEET
Document Type and Number:
WIPO Patent Application WO/2015/083585
Kind Code:
A1
Abstract:
This heat-curable resin composition contains a radical polymerization component, a heat polymerization initiator, and an ammonium salt, and the thermal dissociation initiation temperature of the ammonium salt is 60-140℃.

Inventors:
NISHIO TAKESHI (JP)
Application Number:
PCT/JP2014/081161
Publication Date:
June 11, 2015
Filing Date:
November 26, 2014
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
C08F2/44; C07C211/64; C07C215/90; C08F4/00
Domestic Patent References:
WO2009093872A22009-07-30
WO2012051912A12012-04-26
Foreign References:
JPS307424B1
CN103113251A2013-05-22
JPS59139326A1984-08-10
JP2006506466A2006-02-23
JPS60103065A1985-06-07
JPS6253311A1987-03-09
JPH05310850A1993-11-22
JP2011074190A2011-04-14
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)
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