Title:
COMPOUND, HEAT-CURABLE RESIN COMPOSITION, AND HEAT-CURABLE SHEET
Document Type and Number:
WIPO Patent Application WO/2015/083585
Kind Code:
A1
Abstract:
This heat-curable resin composition contains a radical polymerization component, a heat polymerization initiator, and an ammonium salt, and the thermal dissociation initiation temperature of the ammonium salt is 60-140℃.
Inventors:
NISHIO TAKESHI (JP)
Application Number:
PCT/JP2014/081161
Publication Date:
June 11, 2015
Filing Date:
November 26, 2014
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C08F2/44; C07C211/64; C07C215/90; C08F4/00
Domestic Patent References:
WO2009093872A2 | 2009-07-30 | |||
WO2012051912A1 | 2012-04-26 |
Foreign References:
JPS307424B1 | ||||
CN103113251A | 2013-05-22 | |||
JPS59139326A | 1984-08-10 | |||
JP2006506466A | 2006-02-23 | |||
JPS60103065A | 1985-06-07 | |||
JPS6253311A | 1987-03-09 | |||
JPH05310850A | 1993-11-22 | |||
JP2011074190A | 2011-04-14 |
Attorney, Agent or Firm:
HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)
Koichi Hirota (JP)
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